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粤ICP备11081956号-1
粤公网安备44030502001561号
Low vibration mechanism that is suitable for the inspection of the PCBA before reflow process
- ♦Drive mechanism of high rigidity camera
Achieved high-speed and smooth driving of imaging unit with high rigidity X-Y biaxial driving mechanism. - ♦Fixation of PCBA
It is suitable for the PCBA inspection even before reflow process because only camera is driven while the PCBA stands still on a conveyer during inspections. - ♦Control technology of acceleration and slowdown
Adopted a motion control technology for high-speed and low vibration driving, which is developed for the Semiconductor wafer conveyance robot. Minimized the vibration influence on part before fixing it
Compact body is suitable for additional placement to the existing line
*Just an example. It is recommended to place an conveyor between Sherlock-300I and reflow oven in case of placing it after relow oven.
Specifications
*Please see the table by scrolling horizontally.
| PCBAs to be inspected | M size | ○ |
|---|---|---|
| L size | - | |
| Dimensions | 50mm (W)×50mm (D) to 330mm (W)×250mm (D) | |
| Thickness of PCBA | 0.5 to 2.0mm | |
| Maximum weight of PCBA | 1kg | |
| Height limit of PCBA (Clearance) |
Upper side | 25mm (Resolution：12.4μm/pixel) 30mm (Resolution：18.7μm/pixel) |
| Under side | 70mm | |
| Resolution | 12.4μm/pixel 18.7μm/pixel (Selected before shipment) |
|
| Minimum components to be inspected (JIS) | 0402 (Resolution：12.4μm/pixel) 0603 (Resolution：18.7μm/pixel) |
|
| Inspection speed | 5,000mm2/s (*in case of resolution：18.7μm/pixel) |
|
| Main inspection items | Component inspection | Missing parts, displacement, defective standing, polarity, foreign objects, wrong parts, inversion, character recognition (OCR) |
| Solder inspection | Excess, Insufficient, unsoldered, bridges, solder ball | |
| Imaging range | 25.4mm×13.5mm (Resolution：12.4μm/pixel) 38.3mm×20.3mm (Resolution：18.7μm/pixel) |
|
| Depth of field | 6mm (Resolution：12.4μm/pixel) 10mm (Resolution：18.7μm/pixel) |
|
| Repeatability of positioning | ±50μm | |
| Camera | 2M Pixel | |
| Lighting | RGB + warm white LED | |
| Structure of imaging unit | Optical system with the object side telecentric lens | |
| Flow direction of PCBA | Right to left/left to right (selected before shipment) |
|
| Driving system of imaging unit | High rigidity biaxial driving | |
| PCBA clamping unit | Air clamp | |
| Width adjustment for transferring conveyor | Automatic | |
| Passline | 920±50mm | |
| Reference position for PCBA width | Front | |
| Monitor | 21.5" touch panel display | |
| PC | OS | Windows 10 Pro 64bit Japanese/English (selected before shipment) |
| Memory | 8GB | |
| Interface between equipments | Conformance to SMEMA standard | |
| Environment conditions for operation | 10 to 35℃/30 to 80%RH (no condensation) | |
| Environment conditions for storage | -10 to 60℃/30 to 80%RH (no condensation) | |
| Power supply | AC100 to 240V ±10% (single phase) 50/60Hz |
|
| Compressed air consumption | Compressed air ：0.5MPa Air consumption ：5Nℓ/min |
|
| Dimensions of main unit (excluding protruding portion) |
W620×D758×H1,294mm *in case of the pass line 900mm |
|
| Weight (excluding PC) | 154kg | |